Thermal Tests
The peripherals listed in section 3 were installed in the chassis and K-type thermocouples were attached at the points designated in section 3.1. The chassis was tested in a controlled temperature chamber held at a constant 35oC. The system was run under the *Microsoft Windows 2000 environment where a test program was initialized that exercises the processor up to the 100% Thermal Design Point (TDP). A *Fluke data-logger then sampled the thermocouples every thirty seconds for 90 minutes providing a total of 180 data points. The system was exercised until the initial thermal gradient reached a consistent level with a slope nearing zero. During testing, the ambient temperature was monitored approximately 10cm from the front bezel of the chassis.

Data Recorded

  • Chassis internal ambient temperature (taken .3" behind exhaust fan)
  • Room temperature
  • Processor case temperature
  • .3" above the center of the processor fansink.


Thermal Test Results

Data Recorded
Spec Limit (oC)
Result(oC)
Tcase:
70.0
61.9
Tfan_inlet:
45.0
41.6
Tchassis Amb:
45.0
38.6
Troom:
35.0
35.0
Note: IR = Improvement Required

 

  • Tchassis Amb: Chassis internal ambient temperature
    (taken .3" behind exhaust fan)
  • Troom: Room temperature
  • Tcase: Processor case temperature
  • Tfan_inlet: .3" above the center of the fansink

 

 

Summary/Recommendations

  • Mechanical Test: Pass
  • Thermal Test: Pass
  • PSU Test: Not performed at this time.

Congratulations, the chassis tested passed the thermal and mechanical testing. Please reference the recommendations below:

  • Please be aware that the PentiumR 4 Processor/D850GB platform requires the new ATX12V power supply.
  • To support the Intel performance processor roadmap, we are STRONGLY recommending a processor fan inlet temperature of <40oC.
  • D850GB can support up to three(3) 3-wire chassis fans. Please take this into account when making your fan selections.
  • As the chassis manufacturer it is your responsibility to provide the PEM studs and screws to mechanically support the PentiumR 4 Processor properly. We recommend that these PEM studs and screws be packaged separately from the other mounting hardware to avoid confusion when assembling.
  • Due to the added cost of a chassis fan, new ATX12V, and mechanical mounting requirements, we are recommending that chassis vendors provide a performance chassis SKU/Part Number for the distribution channel to support Intel's performance processors.

Please note that system level thermal performance is configuration dependent. A successful result from this test does not guarantee thermal specification compliance for all possible system configurations and does not consider product safety requirements. You are strongly urged to conduct your own testing with multiple configurations.

For more information on processor thermal design requirements please visit our website at:
http://support.intel.com/support/processors/thermal/system.htm

For form factor information please visit:
http://www.teleport.com/~ffsupprt/

Thank you once again for your participation in this program.

 

Product Safety Notice

The thermal, mechanical, and electrical testing conducted on this chassis did not evaluate product safety requirements. It is the manufacturer's responsibility to assure the chassis complies with all national and local safety requirements within the country sold. Contact your National Certification Body (NCB) or a third party certifier, like Underwriters Laboratories (UL) http://www.ul.com , for further guidance.

 

 

 

*All brands and names are the property of their respective owners.