Test Results

Summary

Processor:
With MaxPower Prescott Processor V1.2 running, the case temperature specification of the 3.2 GHz Prescott processor was not exceeded under these worst-case conditions. The temperatures measured were within specifications by a margin of 1.1C on the CPU.

Details

Summary of Test Results:

Test Points
Max Specified Temp Limit (C)
Measurements
@ 35C
Margin (C)
Processor Test
CPU Utilization 90%
 MaxPower Prescott Processor V1.2
 
Temperature - Ambient (inlet)
35
35.0
(normalized)
Temperature - CPU (case)
70(+0.9C)
68.9
1.1
Temperature - CPU Ambient*
38(+0.9C)
37.1
0.9
Temperature - Exhaust
N/A
38.8
N/A

normalized to 35c, last 10 values averaged of PSU/MEM/Rear IO/Add-In card T/C orientation and then those values are averaged to obtain the CPU ambient that is posted in the above table.

Mechanical Notes: 1 to 2 cm gap between intake duct and active heatsink.
                          without Micro Mesh screen on CPU side intake air duct
Thermal Interface Material: PCM 45F Size: 25mm x 25mm Phase Change Material

 

Conclusions
The Task TK-6000 chassis (as tested) does provide adequate cooling for the 3.2 GHz 800MHz FSB Prescott processor.

The margins in this report reflect a combination of multiple worst cases. The data reflects the temperature of the components at the maximum specified temperature of 35C while running software applications designed to highly stress each hardware configuration.

These test cases do not necessarily represent the worst-case peripheral positions. In addition, the system is not maximally loaded with add-in cards and their associated cables that could cause the internal temperatures to increase and reroute airflow.

 

ATX Mechanical Design Check Sheet

Task chassis model TK-6000
See ATX 2.03 specification for details concerning mechanical size restrictions.

Keepout Zones
    
PASS/IR
   
Zone A .3" clearance compliant?
Notes: Rear exhaust fan interference.
IR
   
Zone B clearance compliant?
Notes:
PASS
   
Zone C clearance compliant?
Notes:
PASS
   
Zone D clearance compliant?
Notes:
PASS
 
Zone E clearance compliant?
Notes:
PASS
I/O Zones
    
   
Horizontal Dimension Compliant?
Notes:
PASS
   
Vertical Dimension Compliant?
Notes:
PASS
   
.1" keep out Compliant
Notes:
PASS
Mounting Holes
    
   
Holes A, B, C, F, G, H, and J, R supported?
Notes:
PASS
   
Standoffs B, D, E and R removable?
E not supported.
E not supported.
   
423 Direct Attach holes in proper location?
Notes:
N/A
IR = improvement required N/A = not applicable

 

Front Panel I/O Cable Length Verification
The cable was found to be of sufficient length to reach the motherboard front panel header.

 

Product Safety Notice
The thermal, mechanical, and electrical testing conducted on this chassis did not evaluate product safety requirements. It is the manufacturer¡¦s responsibility to assure the chassis complies with all national and local safety requirements within the country sold. Contact your National Certification Body (NCB) or a third party certifier, like Underwriters Laboratories (UL) http://www.ul.com, for further guidance.

 

Suggestions for improvement
Thermal Considerations:

1)
Removet Micro Mesh screen on CPU side intake air duct

 

 

Calibration Information
Watlow Dual 96 Temperature Controller
          (thermal test cells)
          Measurement and Control Services calibration control number 13501
          Calibration Due date: 28Apr05

Fluke Hydra Data Acquisition Unit
          Westcon calibration control numberd)  R112767
          Calibration Due date: 7Nov04

 

Appendix A - System Set-up

Figure 1: Task International, Inc. chassis model TK-6000

Figure 2: Side cover removed showing component placement.

Figure 3: Power supply label.

Figure 4: Front view showing peripherals placement.

Figure 5: Cover removed showing motherboard mounting holes.

Figure 6: Air Duct.

Figure 7: Air Duct with Micro Mesh Screen removed.